Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator A very compact, fully automated, vacuum loadlocked plasma system for semi-conductor production. Available in either Reactive Ion Etch (RIE) configuration, High Density Inductive Coupled Plasma (HDICP) or Plasma Enhanced Chemical Vapor Deposition (PECVD) configuration. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.

High productivity

• The HDICP provides the user with high rate/high selectivity processing
• The Vacuum Cassette Elevator (VCE) pumps down the entire wafer cassette, which reduces particles and increases throughput
• The small system width provides very high throughput per linear foot in the fab

Production proven hardware

• Trion proven advanced, reliable, PLC and control system
• Trion Technology wafer transport module
• Small footprint
• Clean room interface

Easy maintenance

• Fast turn-around

State-of-the-art design concepts

• Modular design - more control hardware on-board
• Windows-based GUI
• Touch screen input, 15.1” TFT monitor
• Embedded industrial computer – high reliability

High specification platform

• Single wafers or mounted parts (3” to 300mm)
• Multiple size batch capability (4x3”; 3x4”; 7x2”)
• Single vacuum cassettes with manual door
• Wafer mapping