Request More Information :: Trion Technology :: Power of Simplicity :: Manufacturer of Plasma Etch & Deposition Systems Since 1989

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PROCESS
Etch Single Deposit Batch Strip

Substrate Process Loading
Manual Cassette Loadlock

SUBSTRATE
Die Dim: W: 50 x 50mm \| Thickness 300 µ
2. Die Dim: W: x mm \| Thickness µ
3. Die Dim: W: x mm \| Thickness µ
4. Die Dim: W: x mm \| Thickness µ

1. Full Wafer Round Square
Dim: mm	Thickness µ

2. Full Wafer Round Square
Dim: mm	Thickness µ

3. Full Wafer Round Square
Dim: mm	Thickness µ

4. Full Wafer Round Square
Dim: mm	Thickness µ

Substrate Base Material
1.	2.
3.	4.
5.	6.
7.	8.
9.

Substrate Layer Material/Type To Be Etched/Deposited
1. Polyimide	2. PMMA
3.	4.
5.	6.
7.	8.
9.

Substrate Layer Material Thickness And Uniformity
1. µ/Å	2. µ/Å
3. µ/Å	4. µ/Å
5. µ/Å	6. µ/Å
7. µ/Å	8. µ/Å
9. µ/Å

Process Recipe Customer Supply With Tool
If Customer Provided Recipe, Please Provide Details:


Gasses Used
1.	2.
3.	4.
5.	6.
7.	8.
9.

Dopant Level
Thickness/Uniformity	µ/Å
Topography
Mask Type And Thickness
Other Mask Type
Thickness
Minimum Line Width
% Surface Coverage By Photoresist Or Other Mask	%

Desired Uniformity
Across Wafer	+/– %
Wafer To Wafer	+/– %

FACILITIES
Voltage Power Available
Volt Ampere # of phases Hz

Chill Water (PCW) (12°C > 18°C)
In-House With Tool

Compressed Air (CDA)
PSI/Bar CFM

Vacuum
Rough Vac	Customer Supply With Tool
High Vac	Customer Supply With Tool
Turbo Molecular Pump	Customer Supply With Tool
Dry Pump	Customer Supply With Tool

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